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Wandel & Goltermann OLP-10 User Manual

Wandel & Goltermann OLP-10
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Service Manual
OLP-101-15
Test Techniques for
SMD
Boards
Never make direct connections (e.g. with a probe) to SMDs when you are checking them out.
Instead, use tracks, test pads or vias.
If you are using a special probe with a sprung prod, only make contact at the foot of the
component (see Figure 2-1).
Fig.
2-1
Makjng measurements on SMD boards
SMD
Handling Instructions
As incorrect handling of SMD components affects their characteristics, special care must be
taken. For example, even minor contamination of the SMD pins, say a fingerprint, prevents
effective wetting during soldering and so causes soldering defects. The separation between
pins is often so small that traces of solder left by unsuitable tools can cause short circuits.
Always observe the following
rules
-
Only use special SMD tools and equipment.
-
It is always best to use special SMD tweezers.
-
Handle SMDs in the original condition (as delivered).
-
Only use the original packaging to store and transport SMDs (component identification).
-
Never touch SMDs with your bare fingers.
-
Do not touch SMD pins (even with normal tools, for example tweezers, etc.). Special SMD
test equipment, like test tweezers, etc. may however be used.
-
SMDs that have been dropped must be thrown away (hairline cracks, especially with larger
components).
-
SMD identity check (measurement of
R
and
C,
etc.) should only be carried out using special
SMD test tweezers if the components have not been inserted in a board.
Artisan Technology Group - Quality Instrumentation ... Guaranteed | (888) 88-SOURCE | www.artisantg.com

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Wandel & Goltermann OLP-10 Specifications

General IconGeneral
BrandWandel & Goltermann
ModelOLP-10
CategoryMeasuring Instruments
LanguageEnglish

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