3 Conditions of Acceptability
YASKAWA ELECTRIC TOBP C710606 40A YASKAWA AC Drive - J1000 Finless Installation Manual 9
Figure 3
Figure 3 Output of Heatsink Plate Temperature by Analog Output
Note: 1. Accuracy of the temperature reading may vary ±5 ºC between 50 and 100 ºC.
2. The heatsink temperature is affected by the ambient temperature. Never exceed the allowable maximum
heatsink plate temperature.
◆ Installation to Metallic Surface
The mating surface shall have the following properties:
• Surface flatness shall not exceed 0.2 mm across the entire mating surface.
• Surface roughness shall not exceed 25 S.
Note: A surface roughness of 25 S means “Ra” (average roughness) is not greater than 6.3 a and “Ry”
(maximum peak) is not greater than 25 μm.
◆ Thermal Compound
Apply a thermal compound between the heatsink plate and the mating surface. The thermal
compound assists in drive heat dissipation.
Yaskawa recommends the thermal compounds in Table 2.
Table 2 Recommended Heatsink Plate Thermal Compounds
When applying the thermal compound, spread it over the surface of the heatsink plate. After
mounting the heatsink plate to the metal back panel, wipe away any excess compound from
around the heatsink plate.
Manufacturer Type Model Recommended spread amount
Shin-Etsu Chemical Inc. Oil-based compound G746
100 μm
Apply the coating evenly across the surface
Dow Corning Toray Inc.
Silicone compound
for heat dissipation
SC4471CV
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