ADT 7100 User Manual System Overview
1.2.2 MATERIAL REQUIREMENTS
The ADT 7100 is classified as a “Metals” tool. A complete list of approved materials can be
found on the LNF wiki tool page.
Samples preparation and post-dicing process cleaning
The samples that have been processed in the ADT 7100 dicing saw are considered “dirty”
and not suitable to run in any other system in the cleanroom immediately after. Therefore, the
dicing of samples should be one of the last steps in the process flow. The following steps are
mandatory if the diced samples need to be further processed in any other system in the main LNF
cleanroom. Furthermore, for access to CMOS Clean tools after the dicing saw, see note below in
red for extra measurements.
1. Coat the backside of the substrate with SPR-220 photoresist. At least 3um thickness is
recommended.
2. Bake at 115°C for about 2 min.
3. Coat the front side of the substrate with SPR-220 photoresist. At least 3um thickness is
recommended.
4. Bake at 115°C for about 2 min.
5. Dice following the standard procedure.
6. Rinse for at least 30 seconds in DI water and remove from tape.
7. Remove PR from diced samples in ROBIN lab Solvent 94
8. Acetone in beaker at least 1 minute
9. IPA in beaker at least 1 minute
10. Dry (N2 gun)
11. Piranha clean in ROBIN lab Acid bench 92
12. RCA clean in the main cleanroom in the RCA bench 81
13. For samples to be allowed into CMOS Clean tools after dicing, follow the process
above and then, in addition, perform a pre-furnace clean in bench PFC 01.
Notes: If you foresee an issue with this procedure/process for your specific samples, you must
submit a helpdesk ticket for staff to review. For sapphire samples, follow all steps of procedure
above, but substitute a 60 second 10:1 HF and SC2 clean instead of Piranha clean in ACID-92.
Piranha will roughen sapphire.
Materials to diced
The ADT 7100 dicing saw is designed for dicing silicon wafers. However, other materials
have been successfully processed. Such materials include fused silica, borosilicate glass,
sapphire, silicon carbide, silicon oxide, silicon nitride, and more.
Lurie Nanofabrication Facility 1-2
To Next Page
Loading...