ADT 7100 User Manual System Overview
Most tasks can be performed from the menus on the top of the screen or the quick access
buttons (icons) on the user interface. A picture of the main screen (i.e., the video workspace) is
shown above. The wizard guides you through most of the tasks that you will perform. There is a
window on the left with an overview drawing of the wafer and a window on the right that can
show details of the wafer (this is the camera view). The functions of the quick access buttons and
more will be discussed later in this SOP.
Definitions
Workpiece: Sample to be diced. It could be an entire wafer or pieces.
Wafer Thickness: The thickness of the workpiece, including all layers.
General Tab: Recipe parameters that affect all cuts.
Angle 0/1: Recipe parameters that affect the 0-degree angle.
Angle 90/2: Recipe parameters that affect the 90-degree angle.
Cutting Speed: The speed of the Cutting Chuck in the X direction during the cut.
Depth: How close the blade will be to the chuck surface during cutting.
Street: Usually the path in which to cut. Streets are physically predefined during workpiece
manufacture.
Index: The distance along the Y-Axis between adjacent cuts in a Workpiece. Multiple Indices of
various lengths can be defined for a Workpiece. The first Index is the Main Index, and
subsequent Indices are subindices. Each Index can have a different Cut Depth and Speed.
Kerf: The width of the saw cut.
Flange: Used to mount hubless blades so they can be placed on the spindle. They are also
referred to as a hub.
Blade Exposure: The amount of blade exposed outside of the flange or hub. This must be
significantly greater than the maximum cut depth.
Cleavage Plane
1. {100} wafers, natural cleavage plane, exists perpendicular to the surface of the wafer in
the directions parallel and perpendicular to the wafer flat.
2. {111} wafers, a vertical cleavage plane, runs parallel to the wafer flat.
Lurie Nanofabrication Facility 1-4
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