AMD XILINX VPK180 - Board Features

Board Features
The VPK180 evaluaon board features are listed here. Detailed informaon for each feature is
provided in Chapter 3: Board Component Descripons.
• XCVP1802, LSVC4072 package
• Form factor: see Board Specicaons
• Onboard conguraon from:
○ USB-to-JTAG bridge
○ JTAG pod 2 mm 2x7 at cable connector
○ microSD card (PS MIO I/F)
○ Quad SPI (QSPI)/eMMC (system controller I/F)
○ Dual QSPI
• Clocks
○ ACAP bank 702/5/8 Si570 LPDDR4_CLK1/2/3 (DIMM) 200 MHz
○ ACAP bank 503 Si570 REF_CLK 33.3333 MHz
○ ACAP bank 503 RTC Xtal 32.768 kHz
○ IEEE-1588 eCPRI 8A34001 clocks (various)
○ ACAP bank GTY102/4 (REFCLK0) HSDP dedicated clocks
○ ACAP bank GTY200/1 (REFCLK0) FMC provided
○ ACAP banks GTM109, GTM110, GTM111, GTM112, GTM115, GTM116, GTM117,
GTM118 RC21008A 156.25 MHz
○ ACAP banks GTM208, GTM209, GTM210, GTM211, GTM214, GTM215, GTM216,
GTM217 RC21008A 156.25 MHz
• Three LPDDR4 interfaces (2x32-bit 4 GB components each)
○ XPIO triplet 1 (banks 700, 701, 702)
○ XPIO triplet 2 (banks 703, 704, 705)
○ XPIO triplet 3 (banks 706, 707, 708)
• PL FMCP HSPC (FMC+) connecvity
○ FMCP1 HSPC full LA[00:33] bus
Chapter 1: Introduction
UG1582 (v1.0) February 21, 2023 www.xilinx.com
VPK180 Board User Guide 7
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