Figure 28: DAC: Eight Transmitter Signal Lanes
T0T1
0
2
1
3
0
2
1
3
Tile Channel
JHC2
DAC_T0_CH0
DAC_T0_CH1
DAC_T0_CH2
DAC_T0_CH3
JHC1
JHC4
DAC_T1_CH0
DAC_T1_CH1
DAC_T1_CH2
DAC_T1_CH3
JHC3
DAC
X25995-112321
Note: For ZCU670-specic mapping, see XM755 to ZCU670 Signal Mapping (XTP719).
Features
The XM755 balun add-on card uses the 8 x 50 x 2 female LPAM-50-01.0-L-08-2-K-TR
connectors and pinout as dened in XM650/755 Connector Pinouts. For signal break-out Carlisle
CoreHC2 connectors and cable assemblies are used. Digital I/O and I2C are supported on
headers.
The XM755 module features are:
• 16 ADC dierenal signals to 4 male Carlisle CoreHC2 connector pads
• 16 DACs dierenal signals to 4 male Carlisle CoreHC2 connector pads
• 2 ADC inputs – compression mount SMAs through low frequency baluns – Minicircuits
TCM2-33WX+
Appendix D: HW-XM650/755 Balun Daughter Cards for RFSoC EVM
UG1532 (v1.0) March 30, 2022 www.xilinx.com
ZCU670 Board User Guide 77
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