Belden Hirschmann MIPP - 3 Expanding the Device; Assembly of LC, SC and CU Modules; Disassembling the Device

20
MIPP
Release 01 01/12
3 Expanding the device
You have the following options to expand the device according to your needs:
 Add module to device
 Add RJ45 Keystone jacks to CU modules
3.1 Assembly of LC, SC and CU modules
The device can be expanded until the total of 6 single modules. 1 double
module can be used instead of 2 single modules.
The following sequence has proven itself in practice during installation:
 Remove device
 Expand housing for additional modules
 Install the installation cable on the modules
 Mount modules in the housing
 Mount device on the DIN rail or wall mounting plate
 Connect device
You will require the following tools (not included in the delivery):
 Hexagon socket wrench
 Screw driver
Prepare the following device components:
 2 housing bolts with the respective length (a total of 30 mm per single
module, 60 mm per double module; see page 22 “General technical data”
and page 23 “Accessories and order numbers”)
 1 slider with the respective length (a total of 30 mm per single module,
60 mm per double module; see page 22 “General technical data” and
page 23 “Accessories and order numbers”)
 Spacer with divider
3.1.1 Disassembling the device
Proceed as follows:
 Remove the patch cable from the device.
 Remove the modules.
 Press the device down and push forward away from the rail.