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4.1 Placed “AL” on the “HSG DMD”. The “raised surface” of “AL” shall toward “DMD direction”
(Fig. 4-1).
4.2 To assemble ”HSG ILL SUB Module” with “HSG DMD” and cover over on “AL” and the then
lock with screws(Fig. 4-2).
5. DMD and Chip B/D Module:
5.1. Judge Chip B/D and DMD alignment keying first (Fig. 5-1, 5-2).
5.2. Alight keying and Assemble DMD to Chip B/D (Fig. 5-3).
5.3. Push DMD slightly and use screwdriver rotate clockwise button to lock (close notation) DMD
on Chip B/D (Fig. 5-4).
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