BFGoodrich Avionics Systems, Inc.
Component Maintenance Manual
P/N
501-1075-()
CAUTION GUARD
AGAINST
OVERHEATINGCIRCUITBOARDLANDS
ANDADJACENT
COMPONENTS.
EXCESSIVE
HEAT
WILLDAMAGE
SEMICONDUCTORS
AND
CAUSE
CIRCUIT
BOARD
PATTERNS,
TRACKS
ANDLANDS
TO
DETACHFROM
THEBOARD.
4)
Set
soldering
iron to appropriate temperature and apply
iron
tip to original
solder
connection on
secondary side of
board.
5) Remove all flowing solder
and
discarded component
leads
from
original connection with
suction and/or
wicking
wire.
WARNING: ISOPROPYLALCOHOLHASBEENIDENTIFIEDASHAVING
ADEGREEOFHAZARDIN
HEALTHANDFLAMMABILITY.
CONSULT
THE
APPLICABLE
MATERIAL
SAFETY
DATA
SHEETPRIORTO
USE
ORASSOCIATIONWITH
THIS
PRODUCT.
PIN
516-2000-01
6) Clean the
affected circuit
lands
and tracks with
Isopropyl Alcohol.
C.
Installation of
Components
1) Tin all
intended components
and
wire leads
prior
to soldering.
2) Insure that
the affected circuit board lands
and
holes
are
thoroughly clean.
3) Place
replacement component
into
appropriate
holes, insuring
proper pin location
and
component polarity.
4)
Bend, clinch
and cut the component
leads
insuring
appropriate
component
clearance and
lead
mounting.
5) Apply flux
to
intended connection.
6)
Set
Solder
iron to appropriate temperature setting.
7) Apply
solder iron
tip
to
intended connection,
insuring
that tip is in
contact with
both
component
lead and circuit
board
land.
8) Apply solder
to
connection.
9) Clean
new
connection with isopropyl alcohol.
10) Apply
conformal
coating for
moisture
and fungus
proofing after
successful
completion of
the performance test.
3.
Performance Test
Verify
serviceability
of
the
reworked
CCA
by
performing applicable performance tests cited
in
Testing
and Fault
Isolation
section.
4.
Moisture
And
Funeus Proofing
Apply coating to
reworked
CCA in
accordance
with
MIL-T-152B
as
follows:
msmijtp202Repairdiskl59
24-20-03
Page 602
Revision
A
June 30,
1999
To Next Page
Loading...