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Attaching mounting brackets (E, F) for Intel LGA 1366/115X/775 installation.
Installing standoffs (P) for different Intel socket types (LGA 775, 115x, 1366).
Securing standoffs (C) onto the motherboard using a screwdriver (K).
Applying thermal paste (B) to the CPU before mounting the heatsink.
Attaching the heatsink using mounting brackets (P) and screws (R) for Intel CPUs.
General| Type | Cooler |
|---|---|
| Maximum airflow | 53.38 cfm |
| Suitable location | Processor |
| Maximum air pressure | 1.65 mmH2O |
| Rotational speed (max) | 1800 RPM |
| Rotational speed (min) | 650 RPM |
| Noise level (low speed) | 6 dB |
| Noise level (high speed) | 31 dB |
| Supported processor sockets | LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1366 (Socket B), LGA 2011 (Socket R), LGA 2011-v3 (Socket R), LGA 2066, Socket AM2, Socket AM2+, Socket AM3, Socket AM3+, Socket AM4, Socket FM1, Socket FM2, Socket FM2+ |
| Fan connector | 4-pin |
| Fins material | Aluminum |
| Illumination LED | Yes |
| Illumination color | Blue, Green, Red |
| Number of heat pipes | 4 |
| Mean time to failure (MTTF) | 40000 h |
| Rated voltage | 12 V |
| Safety current | 0.37 Ah |
| Power consumption (typical) | 3.6 W |
| Harmonized System (HS) code | 84733080 |
| Quantity per master (outer) case | 8 pc(s) |
Weight and Dimensions| Depth | 111.8 mm |
|---|---|
| Width | 130.9 mm |
| Height | 165.1 mm |
| Weight | 960 g |
| Package depth | 167 mm |
| Package width | 155 mm |
| Package height | 232 mm |
| Package weight | 1180 g |
| Heatsink weight | 820 g |
| Heat pipes diameter | 6 mm |
| Fan dimensions (W x D x H) | 120 x 120 x 165.1 mm |
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