SMDCOMPONENTREPLACEMENT
©CyrusAudioLtdJun2014 3 CDtServiceManualIssue1
Whenusingsolderpasteapressuredispensershouldbeusedtoensurethecorrectamount
ofsolderisappliedtoeachpad.
Solder paste should not be used with direct heating methods as the solder between
componentpinsmaynotbemelted.
Ifnecessary,removeexcesssolderpastewithsolderbraid.
RemovingSMDresistorsandcapacitorsfromthePCBwithasolderingiron
1. Fitthesolderingironwithatiplargeenoughtobridgebothendsofthecomponent.
2. Placethesolderingironsothatitsflattipwillheatbothendsofthecomponentatonce.
3. Whenthesoldermelts,removethecomponentwithtweezers.
4. Allow the PCB to cool for a few minutes, removing any excess solder with desoldering
braid.
FittingreplacementSMDresistorsandcapacitorstothePCBwithasolderingiron
1. Applyalittlefluxtotheconnections.
2. Placethecomponentinposition.
3. Tin the soldering iron, bring the tip into contact with the PCB pad and flow solder to the
joint.Avoidbringingthesolderingirontipdirectlyintocontactwiththecomponent.
RemovingSMDICsfromthePCB
1. Using fine tipped side cutters or tweezer cutters, snip all the leads of the device and
removetheICbody.
2. DesoldertheleadsfromthePCBpads.
3. CleanupthePCBwithsolderbraid.
RemovingSMDICswithahotairSMDtool
1. FitasuitablesizetipfortheICbeingremoved.
2. HeattheICevenlyuntilthesoldermelts.
3. RemovetheICwithtweezers.
FittingreplacementICstothePCBwithasolderingiron
1. CheckthatthepinsoftheICarenotdistorted.
2. Usingtweezers,positiontheICoverthefootprint.
3. CheckthatalltheICpinsarecorrectlyalignedwiththepads.
4. Withaveryfinetipsolderingiron,solderinthepinsatthecornersofthe
IC.
5. Re‐checkthealignmentandcorrectifnecessary.
6. WhenthealignmentisOK,soldertheremainingpinsoftheICtothePCB.