Dell EMC VxFlex Ready Node R740xd - Particulate and Gaseous Contamination Specifications

Expanded operating temperature restrictions
The following additional restrictions apply:
l
Do not perform a cold startup below 5°C.
l
The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
l
150 W/8 core, 165 W/12 core and higher wattage processor [Thermal Design Power (TDP)>165 W] are not
supported.
l
Redundant power supply unit is required.
l
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
l
PCIe SSD is not supported.
l
DCPMMs are not supported.
l
Mid drive tray is only supported on VxFlex Ready Node.
l
Tape backup unit is not supported.
Ambient temperature limitations
The following table lists configurations that require ambient temperature of less than 35°C.
Note: The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess processor
throttling, which may impact system performance.
Table 25 Configuration based ambient temperature restrictions
System Backplane Processor
Thermal Design
Power (TDP)
Processor heat
sink
Fan type GPU Ambient
restriction
R740xd 24 x 2.5 inch
SAS/SATA
150 W/8 core,
165 W/12 core,
200 W, 205 W
1U high performance High
performance fan
≥1 double-
width/single-
width
30°C
24 x 2.5 inch
SAS/SATA + 4 x
2.5 inch + 4 x 2.5
inch
150 W/8 core,
165 W/12 core,
200 W, 205 W
High performance fan NA 25°C
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulate and
gaseous contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in
equipment damage or failure, you may need to rectify the environmental conditions. Remediation of environmental
conditions is the responsibility of the customer.
Technical specifications
R740xd Owner's Guide 31