Dell PowerEdge R830 - General Memory Module Installation Guidelines; Mode-Specific Guidelines

DIMM Type DIMMs Populated/
Channel
Voltage
Operating Frequency (in
MT/s)
Maximum DIMM Rank/
Channel
3 1866 Dual rank or single rank
LRDIMM 1
1.2 V
2400, 2133, 1866 Quad rank
2 2400, 2133, 1866 Quad rank
3 2133, 1866 Quad rank
General memory module installation guidelines
NOTE: Memory congurations that fail to observe these guidelines can prevent your system from booting, stop
responding during memory conguration, or operating with reduced memory.
The system supports Flexible Memory Conguration, enabling the system to be congured and run in any valid chipset architectural
conguration. The following are the recommended guidelines for installing memory modules:
• RDIMMs and LRDIMMs must not be mixed.
• x4 and x8 DRAM based memory modules can be mixed. For more information, see the Mode-specic guidelines section.
• Up to three dual- or single-rank RDIMMs can be populated per channel.
• Up to three LRDIMMs can be populated per channel regardless of rank count.
• If memory modules with dierent speeds are installed, they will operate at the speed of the slowest installed memory module(s)
or slower depending on system DIMM conguration.
• Populate memory module sockets only if a processor is installed. For single-processor systems, sockets A1 to A12 are available.
For dual-processor systems, sockets A1 to A12 and sockets B1 to B12 are available.
• Populate all the sockets with white release tabs rst, followed by the black release tabs, and then the green release tabs.
• When mixing memory modules with dierent capacities, populate the sockets with memory modules with highest capacity rst.
For example, if you want to mix 4 GB and 8 GB memory modules, populate 8 GB memory modules in the sockets with white
release tabs and 4 GB memory modules in the sockets with black release tabs.
• In a dual-processor conguration, the memory conguration for each processor should be identical. For example, if you populate
socket A1 for processor 1, then populate socket B1 for processor 2, and so on.
• Memory modules of dierent capacities can be mixed provided other memory population rules are followed (for example, 4 GB
and 8 GB memory modules can be mixed).
• Mixing of more than two memory module capacities in a system is not supported.
• Populate four memory modules per processor (one DIMM per channel) at a time to maximize performance.
Related links
Mode-specic guidelines
Mode-specic guidelines
Four memory channels are allocated to each processor. The allowable congurations depend on the memory mode selected.
Advanced Error Correction Code (lockstep)
Advanced Error Correction Code (ECC) mode extends SDDC from x4 DRAM based DIMMs to both x4 and x8 DRAMs. This protects
against single DRAM chip failures during normal operation.
The installation guidelines for memory modules are as follows:
• Memory modules must be identical in size, speed, and technology.
• DIMMs installed in memory sockets with white release levers must be identical and the same rule applies for sockets with black
release levers. This ensures that identical DIMMs are installed in matched pair —for example, A1 with A2, A3 with A4, A5 with A6,
and so on.
Memory optimized (independent channel) mode
This mode supports Single Device Data Correction (SDDC) only for memory modules that use x4 device width. It does not impose
any specic slot population requirements.
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