Ebyte E108-GN Series - Welding Instruction; Reflow Soldering Temperature; Reflow Soldering Curve

Chengdu Ebyte Electronic Technology Co.,Ltd. E108-GN User Manual
Copyright ©2012–2022，Chengdu Ebyte Electronic Technology Co.,Ltd.
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10 Welding instruction
10.1Reflow soldering temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min(Tsmin)
100℃
150℃
Preheat temperature max(Tsmax)
150℃
200℃
Preheat Time(Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(TsmaxtoTp)
3℃/second max
3℃/second max
Liquidous Temperature(TL)
183℃
217℃
Time(tL)MaintainedAbove(TL)
60-90 sec
30-90 sec
Peak temperature(Tp)
220-235℃
230-250℃
Aveage ramp-downrate(TptoTsmax)
6℃/second max
6C/second max
Time 25° to peak temperature 25℃
6 minutes max
8 minutes max
10.2 Reflow soldering curve