Ebyte E22-230T33S - 12 Production guidance; 12.1 Reflow soldering temperature

Chengdu Ebyte Electronic Technology Co.,Ltd. E22-230TXXS User Manual
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12 Production guidance
12.1 Reflow soldering temperature
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Minimum preheating
temperature
100℃
150℃
Preheat temperature max (Tsmax)
Maximum preheating
temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rise rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Fluid phase temperature
183℃
217℃
Time（tL）Maintained Above（TL）
Time above the liquid-phase line
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temperature
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Average decrease rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
25℃ to peak temperature
6 minutes max
8 minutes max