EasyManua.ls Logo

ECS H57H-M

ECS H57H-M
68 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Loading...
2
Introducing the Motherboard
Feature
Accommodates Intel
®
Lynnfield/Clarkdale processors
Supports “Hyper-Threading” technology CPU
“Hyper-Threading” technology enables the operating system into thinking
it’s hooked up to two processors, allowing two threads to be run in parallel, both
on separate “logical” processors within the same physical processor.
The motherboard uses an LGA1156 type of socket that carries the following
features:
Processor
Chipset
Supports DDR3 1333/1066 DDR3 SDRAM with Dual-channel architec-
ture
Accommodates four unbuffered DIMMs
Up to 4 GB per DIMM with maximum memory size up to 16 GB
Supports 1 Gb, 2 Gb and 4 Gb DDR3 DRAM technologies for x8 and x16
devices (It is not recommended to use 512 Mb DDR3 memory device on
this motherboard)
Memory
Audio
7.1+2 Channel High Definition Audio Codec
Meets Microsoft WLP3.x (Windows Logo Program) audio
requirements
All DACs supports 44.1k/48k/96k/192kHz sample rate
Software selectable 2.5V/3.2V/4.0V VREFOUT
Direct Sound 3D. compatible
Power Support: Digital: 3.3V; Analog: 5.0V
The Intel H57 Express Chipset is a single-chip with proven reliability and per-
formance.
One x16 PCI Express Gen2 ports each supporting up to 8 GB/s direc-
tion peak bandwidth
Compliant with PCI Rev 2.3 interface at 33 MHz
One PCI Express x4 slot compliant with PCI Express Base Specification
revision 2.0
Support PCI Express x1 slot
Integrated SATA 3.0 Gb/s Host Controller
Fourteen USB 2.0 ports supported
Serial Peripheral Interface (SPI) support
Enhanced DMA Controller, interrupt controller, and timer functions
Integrated Graphics Support with PAVP 1.5
Intel
®
High Definition Audio Controller

Table of Contents

Related product manuals