EG&G 113 - Page 31

s
l
Lift the soldering
iron and
remove
the wick
before
it the
component
has been
removed,
use
wicking
to complete-
freezes
to
the joint.
Cut
off the
“filled"
end
of
the
wick
ly
clear
all
solder
from
the
holes.
(generally
about
‘/2
inch should
be
removed).
INSTALLING
COMPQNENTS
t,‘
ineleeet
The
i0in'E-
ii
enV
Seidei
remains.
repeal
The
In returning
the
component
or its
replacement
to
the
Preeedufe
as Fe<IlUiFed-
Then,
Wniie applying
heat Te
keel)
board,
make
sure
the
leads are
bent
on the
proper
centers
the
solder
in
the
hole molten,
pull the
lead
through
the and that they don't
angle in or out. If they do not pass
hole. Components
with
leads
which
cannot be
removed
one
freely
through the
centers of
the
holes, they
may
catch
the
at
a
time,
such as
transistors
and
trimpotentiometers,
can
edge
of the foil
and
lift it.
Bend
and
cut
the
leads
after
be removed
by
applying
heat
to one
of
the
leads and
inserting
the component;
then
solder
the
leads
with
a hot
“rocking"
the component
to
pull
the lead through
the
hole
iron
(no
larger than
40 watts) and
a good
grade
of
rosin
as
far
as
possible,
and successively
repeating
this
for
each
of
core
60/40
solder.
Be
sure
to apply
heat
no
longer
than
the
leads until
the
component
is
free
from
the
board.
After
necessary
to
achieve
a
good
joint (usually
a few seconds).
M
‘\
l
VI-2
Lift the soldering iron and remove the wick before it
freezes to the joint. Cut off the "filled" end of the wick
(generally about % inch should be removed).
Inspect the joint. If any solder remains, repeat the
procedure as required. Then, while applying heat to keep
the solder in the hole molten, pull the lead through the
hole. Components with leads which cannot be removed one
at a time, such as transistors and trimpotentiometers, can
be removed by applying heat to one of the leads and
"rocking" the component to pull the lead through the hole
as far as possible, and successively repeating this for each of
the leads until the component is free from the board. After
VI-2
the component has been removed, use wicking to complete-
ly clear all solder from the holes.
INSTALLING COMPONENTS
In returning the component or its replacement to the
board, make sure the leads are bent on the proper centers
and that they don't angle in or out. If they do not pass
freely
through the centers of the holes, they may catch the
edge of the foil and I ift it. Bend and cut the leads after
inserting the component; then solder the leads with a hot
iron (no larger than 40 watts) and a good grade of rosin
core 60/40 solder. Be sure to apply heat no longer than
necessary to achieve a good joint (usually a few seconds).