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General| Layer Resolution | 0.05-0.3mm |
|---|---|
| Nozzle Diameter | 0.4 mm |
| Filament Diameter | 1.75 mm |
| Connectivity | USB, SD Card |
| Bed Leveling | Automatic |
| Frame Material | Aluminum |
| Printing Technology | FDM (Fused Deposition Modeling) |
| Supported Materials | PLA, ABS, TPU |
| Bed Temperature | Up to 100°C |
| Nozzle Temperature | Up to 270°C |
| Power Supply | 24V |
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