X-CPU 01  4 Start-up 
HI 801 009 E Rev. 4.00  Page 27 of 52 
4 Start-up 
To start up the processor module, insert the processor module into a permissible base plate 
slot, see Chapter 
4.1.1. If the base plate is already operating, the processor module starts 
and adopts the operating state set through its configuration and the mode switch position. If 
the base plate is not operating, connect the supply voltage. 
4.1 Mounting 
Observe the following points when installing the processor module: 
  The module is intended for use within a HIMax base plate. For more information on the 
base plate structure, refer to the corresponding system documentation. 
  Only operate processor modules in the intended slots 
  Only operate the module with forced cooling (X-FAN). 
  Only operate the module with the suitable connector board. For more information, see 
Chapter 
3.6. 
  Effects of removing and inserting the module: 
When removing the module, the connector board remains in the HIMax base plate. 
Since all of the external interfaces are connected via the module's connector board, a 
module can be replaced without affecting the external interfaces 
  The SRS of the module is stored to the connector board and becomes after the module 
is plugged in. 
  Effects of pulling and plugging the plugs 
Pulling the plugs interrupts the external communication.  
Take appropriate grounding measures.  
 
NOTE
 
 
Electrostatic discharge! 
Failure to comply with these instructions can destroy the connector board and/or the 
module. 
  Make sure that the workspace is free of static and wear an ESD wrist strap. 
  If not used, ensure that the device is protected from electrostatic discharge, e.g., 
by storing it in its packaging. 
 
 
  Effects of EMC influences 
Exposing the module to environmental influences other than those specified in the 
manual may lead to malfunctions or even the destruction of the module. 
 
NOTE
 
 
Controller damage or system malfunction possible! 
Only expose the module to permissible environmental influences, see Chapter 
2.1.1