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HP 11 G4 - Page 35

HP 11 G4
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11. Remove the keyboard/top cover.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the keyboard/top cover is removed. Thermal paste is used on
the processor (1) and the heat sink section (2) that services it.
Reverse this procedure to install the keyboard/top cover.
Component replacement procedures 29