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HP G62 User Manual

HP G62
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7 Backup and recovery
Recovery after a system failure is as complete as your most current backup. HP recommends
creating recovery discs immediately after software setup. As you add new software and data files,
continue to back up your system on a regular basis to maintain a reasonably current backup.
Tools provided by the operating system and HP Recovery Manager software are designed to help
you with the following tasks for safeguarding your information and restoring it in case of a system
failure:
Creating a set of recovery discs (Recovery Manager software feature). Recovery discs are used
to start up (boot) the computer and restore the operating system and software programs to
factory settings in case of system failure or instability.
Backing up your information regularly to protect your important system files.
Creating system restore points (operating system feature). System restore points allow you to
reverse undesirable changes to your computer by restoring the computer to an earlier state.
Recovering a program or driver (Recovery Manager software feature). This feature helps you
reinstall a program or driver without performing a full system recovery.
Performing a full system recovery (Recovery Manager software feature). With Recovery
Manager, you can recover the full factory image if you experience system failure or instability.
Recovery Manager works from a dedicated recovery partition (select models only) on the hard
drive or from recovery discs you create.
NOTE: Computers with a solid-state drive (SSD) might not have a recovery partition. Recovery
discs have been included for computers that do not have a partition. Use these discs to recover
the operating system and software. To check for the presence of a recovery partition, select
Start >right-click Computer > click Manage > click Disk Management. If the partition is
present, an HP Recovery drive is listed in the window.
100 Chapter 7 Backup and recovery

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HP G62 Specifications

General IconGeneral
Bus typeDMI
SteppingC2
Tjunction105 °C
Processor cache3 MB
Processor cores2
Processor modeli3-330M
System bus rate2.5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-300 Mobile Series
Processor socketBGA 1288
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency2.13 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)35 W
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
Motherboard chipsetIntel® HM55 Express
Memory slots2x SO-DIMM
Internal memory4 GB
Memory form factorSO-DIMM
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
Memory layout (slots x size)2 x 2 GB
LightScribeYes
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi DL
Total storage capacity320 GB
Compatible memory cardsMemory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed1
Pixel pitch0.259 x 0.259 mm
Display diagonal15.6 \
Display brightness200 cd/m²
Display resolution1366 x 768 pixels
Native aspect ratio16:9
Contrast ratio (typical)300:1
Display number of colors16.78 million colors
Discrete graphics card modelAMD Mobility Radeon HD 5430
On-board graphics card modelIntel® HD Graphics
Discrete graphics card memory0.512 GB
On-board graphics card base frequency500 MHz
On-board graphics card dynamic frequency (max)667 MHz
Audio system-
Speakers manufacturerAltec Lansing
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology10/100Base-T(X)
Ethernet LAN data rates10, 100 Mbit/s
Charging port typeDC-in jack
Headphone connectivity3.5 mm
USB 2.0 ports quantity3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity0
Pointing deviceTouchpad + Scroll zone
Operating system installedWindows 7 Home Premium
Form factorClamshell
Product typeLaptop
Product colorBlack, Silver
Country of originChina
Processor codeSLBNF
Processor ARK ID47663
Processor package sizerPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1, SSE4.2
Battery life (max)- h
Number of battery cells6
AC adapter power90 W
Cable lock slot typeKensington
Cables includedAC
Package depth109 mm
Package width521 mm
Package height345 mm
Operating altitude-15 - 3048 m
Non-operating altitude-15 - 12192 m
Storage temperature (T-T)-20 - 60 °C
Operating temperature (T-T)5 - 35 °C
Storage relative humidity (H-H)5 - 95 %
Operating relative humidity (H-H)10 - 90 %
Sustainability certificatesENERGY STAR
Weight and Dimensions IconWeight and Dimensions
Depth246 mm
Width374 mm
Weight2500 g
Height (rear)36.8 mm
Height (front)31.8 mm

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