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HP G62 User Manual

HP G62
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Equipment guidelines
Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation.
When seated, wear a wrist strap connected to a grounded system. Wrist straps are flexible
straps with a minimum of one megohm ±10% resistance in the ground cords. To provide proper
ground, wear a strap snugly against the skin at all times. On grounded mats with banana-plug
connectors, use alligator clips to connect a wrist strap.
When standing, use foot straps and a grounded floor mat. Foot straps (heel, toe, or boot straps)
can be used at standing workstations and are compatible with most types of shoes or boots. On
conductive floors or dissipative floor mats, use foot straps on both feet with a minimum of one
megohm resistance between the operator and ground. To be effective, the conductive strips
must be worn in contact with the skin.
The following grounding equipment is recommended to prevent electrostatic damage:
Antistatic tape
Antistatic smocks, aprons, and sleeve protectors
Conductive bins and other assembly or soldering aids
Nonconductive foam
Conductive tabletop workstations with ground cords of one megohm resistance
Static-dissipative tables or floor mats with hard ties to the ground
Field service kits
Static awareness labels
Material-handling packages
Nonconductive plastic bags, tubes, or boxes
Metal tote boxes
Electrostatic voltage levels and protective materials
The following table lists the shielding protection provided by antistatic bags and floor mats.
Material Use Voltage protection level
Antistatic plastic Bags 1,500 V
Carbon-loaded plastic Floor mats 7,500 V
Metallized laminate Floor mats 5,000 V
38 Chapter 4 Removal and replacement procedures

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HP G62 Specifications

General IconGeneral
Bus typeDMI
SteppingC2
Tjunction105 °C
Processor cache3 MB
Processor cores2
Processor modeli3-330M
System bus rate2.5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-300 Mobile Series
Processor socketBGA 1288
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency2.13 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)35 W
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
Motherboard chipsetIntel® HM55 Express
Memory slots2x SO-DIMM
Internal memory4 GB
Memory form factorSO-DIMM
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
Memory layout (slots x size)2 x 2 GB
LightScribeYes
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi DL
Total storage capacity320 GB
Compatible memory cardsMemory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed1
Pixel pitch0.259 x 0.259 mm
Display diagonal15.6 \
Display brightness200 cd/m²
Display resolution1366 x 768 pixels
Native aspect ratio16:9
Contrast ratio (typical)300:1
Display number of colors16.78 million colors
Discrete graphics card modelAMD Mobility Radeon HD 5430
On-board graphics card modelIntel® HD Graphics
Discrete graphics card memory0.512 GB
On-board graphics card base frequency500 MHz
On-board graphics card dynamic frequency (max)667 MHz
Audio system-
Speakers manufacturerAltec Lansing
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology10/100Base-T(X)
Ethernet LAN data rates10, 100 Mbit/s
Charging port typeDC-in jack
Headphone connectivity3.5 mm
USB 2.0 ports quantity3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity0
Pointing deviceTouchpad + Scroll zone
Operating system installedWindows 7 Home Premium
Form factorClamshell
Product typeLaptop
Product colorBlack, Silver
Country of originChina
Processor codeSLBNF
Processor ARK ID47663
Processor package sizerPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1, SSE4.2
Battery life (max)- h
Number of battery cells6
AC adapter power90 W
Cable lock slot typeKensington
Cables includedAC
Package depth109 mm
Package width521 mm
Package height345 mm
Operating altitude-15 - 3048 m
Non-operating altitude-15 - 12192 m
Storage temperature (T-T)-20 - 60 °C
Operating temperature (T-T)5 - 35 °C
Storage relative humidity (H-H)5 - 95 %
Operating relative humidity (H-H)10 - 90 %
Sustainability certificatesENERGY STAR
Weight and Dimensions IconWeight and Dimensions
Depth246 mm
Width374 mm
Weight2500 g
Height (rear)36.8 mm
Height (front)31.8 mm

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