HP G62 User Manual

Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some
protection, but in many cases, ESD contains enough power to alter device parameters or melt
silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage might have occurred.
An electronic device exposed to ESD might not be affected at all and can work perfectly throughout a
normal cycle. Or the device might function normally for a while, then degrade in the internal layers,
reducing its life expectancy.
CAUTION: To prevent damage to the computer when removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Use nonmagnetic tools.
Before touching an electronic component, discharge static electricity by using the guidelines
described in this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by different
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
36 Chapter 4 Removal and replacement procedures

HP G62 Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
Processor model	i3-330M
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-300 Mobile Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.13 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM55 Express
Memory slots	2x SO-DIMM
Internal memory	4 GB
Memory form factor	SO-DIMM
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	2 x 2 GB
LightScribe	Yes
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi DL
Total storage capacity	320 GB
Compatible memory cards	Memory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed	1
Pixel pitch	0.259 x 0.259 mm
Display diagonal	15.6 \
Display brightness	200 cd/m²
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Contrast ratio (typical)	300:1
Display number of colors	16.78 million colors
Discrete graphics card model	AMD Mobility Radeon HD 5430
On-board graphics card model	Intel® HD Graphics
Discrete graphics card memory	0.512 GB
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	667 MHz
Audio system	-
Speakers manufacturer	Altec Lansing
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology	10/100Base-T(X)
Ethernet LAN data rates	10, 100 Mbit/s
Charging port type	DC-in jack
Headphone connectivity	3.5 mm
USB 2.0 ports quantity	3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Pointing device	Touchpad + Scroll zone
Operating system installed	Windows 7 Home Premium
Form factor	Clamshell
Product type	Laptop
Product color	Black, Silver
Country of origin	China
Processor code	SLBNF
Processor ARK ID	47663
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2
Battery life (max)	- h
Number of battery cells	6
AC adapter power	90 W
Cable lock slot type	Kensington
Cables included	AC
Package depth	109 mm
Package width	521 mm
Package height	345 mm
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Sustainability certificates	ENERGY STAR

Weight and Dimensions

Depth	246 mm
Width	374 mm
Weight	2500 g
Height (rear)	36.8 mm
Height (front)	31.8 mm