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NOTE: Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,

and processor spare part kits.

The following illustration shows the locations for thermal material on systems with UMA graphics

subsystems.

The thermal material must be thoroughly cleaned from the surface of the fan/heat sink assembly (1)

and (3), and the processor component (2), each time the fan/heat sink assembly is removed. Thermal

pads and thermal paste must be installed on all surfaces before the fan/heat sink assembly is

reinstalled.

The following illustration shows the locations for thermal material on systems with discrete graphics

subsystems.

Component replacement procedures 81

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HP G72 Specifications

General

Display Size	17.3 inches
Resolution	1600 x 900
Graphics	Intel HD Graphics or ATI Mobility Radeon HD 5470
Wireless	802.11 b/g/n
Battery	6-cell Lithium-Ion
Operating System	Windows 7
Weight	6.6 lbs (3 kg)
Optical Drive	DVD±RW
Networking	10/100 Ethernet
Ports	3 x USB 2.0, HDMI, VGA
RAM	Up to 8 GB DDR3