HP M27fe

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 18-March-2021
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and DisplaysExternal Options
Marketing Name / Model
[List multiple models if applicable.]
HP M27fe FHD Monitor
HP M27fe FHD Monitor-NA
HP M27fe
HSD-0091-K
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Display Board*1, Main Board*1
2
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button
style batteries
0
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps panel*1
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
C605 in SPS board
1
External electrical cables and cords
HDMI cable*1, VGA cable*1, Power cord*1
3

HP M27fe Specifications

General

Screen Size	27 inches
Resolution	1920 x 1080 (Full HD)
Panel Type	IPS
Refresh Rate	75 Hz
Aspect Ratio	16:9
Brightness	300 nits
Ports	1 x HDMI 1.4, 1 x VGA
Color Gamut	99% sRGB
Contrast Ratio	1000:1
Viewing Angle	178° horizontal; 178° vertical
VESA Mount	No
Response Time	5 ms
Stand Adjustments	Tilt
Features	AMD FreeSync
Dimensions	61.12 x 20.5 x 45.65 cm (with stand)
Weight	3.4 kg (with stand)

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

Items with a surface greater than 10 sq cm, such as Display Board*1, Main Board*1.

Batteries, excluding Li-Ion batteries

All types including standard alkaline, coin or button style batteries.

Li-Ion batteries

Include all Li-Ion batteries if more than one is provided with the product.

Mercury-containing components

Components containing mercury, e.g., in lamps, display backlights, scanner lamps.

Liquid Crystal Displays (LCD)

Displays with a surface greater than 100 sq cm, including gas discharge lamps panel*1.

Electrolytic Capacitors Condensers

Measuring greater than 2.5 cm in diameter or height.

External electrical cables and cords

Includes HDMI, VGA, and Power cords.

Additional Items Requiring Selective Treatment

Plastics containing Brominated Flame Retardants

Plastics weighing > 25 grams, not including PCBs or PCAs.

Components and parts containing toner and ink

Includes cartridges, print heads, tubes, vent chambers, and service stations.

Tools Required for Disassembly

Screwdriver

Standard screwdriver for disassembly.

Slothead screwdriver

Specific screwdriver for slothead screws.

Product Disassembly Process Steps

External Enclosure Removal

Steps for removing the external enclosure, including stand and rear cover.

Component Cable Disconnection

Procedure for removing acetate tapes and disconnecting LVDS/LED cable.

Internal Component Removal

Steps for removing the rear cover supporter and motherboard (M/B).