NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with
the heat sink and system board spare part kits.
Discrete memory: Thermal paste (1), (2), and thermal pads, (3), (4), are used on the heat sink (2), (4) and
associated system board components (1), (3).
UMA memory: Thermal paste is used on the processor (1) and the heat sink (2).
Reverse this procedure to install the heat sink.
Component replacement procedures 69
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