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HP ProDesk 490 G1 User Manual

HP ProDesk 490 G1
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Populating DIMM sockets
There are two DIMM sockets on the system board, with one socket per channel. The sockets are labeled
DIMM1 and DIMM3. Socket DIMM1 operates in memory channel B. Socket DIMM3 operates in
memory channel A.
The system will automatically operate in single channel mode, dual channel mode, or flex mode,
depending on how the DIMMs are installed.
NOTE: Single channel and unbalanced dual channel memory configurations will result in inferior
graphics performance.
The system will operate in single channel mode if the DIMM sockets are populated in one channel
only.
The system will operate in a higher-performing dual channel mode if the memory capacity of the
DIMM in Channel A is equal to the memory capacity of the DIMM in Channel B.
The system will operate in flex mode if the memory capacity of the DIMM in Channel A is not
equal to the memory capacity of the DIMM in Channel B. In flex mode, the channel populated
with the least amount of memory describes the total amount of memory assigned to dual channel
and the remainder is assigned to single channel. If one channel will have more memory than the
other, the larger amount should be assigned to Channel A.
In any mode, the maximum operational speed is determined by the slowest DIMM in the system.
Installing DIMMs
CAUTION: You must disconnect the power cord and wait approximately 30 seconds for the power
to drain before adding or removing memory modules. Regardless of the power-on state, voltage is
always supplied to the memory modules as long as the computer is plugged into an active AC outlet.
Adding or removing memory modules while voltage is present may cause irreparable damage to the
memory modules or system board.
The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is
important to use memory modules with gold-plated metal contacts to prevent corrosion and/or
oxidation resulting from having incompatible metals in contact with each other.
Static electricity can damage the electronic components of the computer or optional cards. Before
beginning these procedures, ensure that you are discharged of static electricity by briefly touching a
grounded metal object.
When handling a memory module, be careful not to touch any of the contacts. Doing so may damage
the module.
1. Prepare the computer for disassembly (Preparation for disassembly on page 92).
2. Remove the access panel (
Access panel on page 93).
3. Rotate up the internal drive bay housing to access the memory module sockets on the system
board.
98 Chapter 6 Removal and replacement procedures: Small Form Factor

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HP ProDesk 490 G1 Specifications

General IconGeneral
Tcase72.72 °C
Bus typeDMI2
SteppingC0
Processor cache8 MB
Processor cores4
System bus rate5 GT/s
Processor familyIntel® Core™ i7
Processor seriesIntel Core i7-4700 Desktop series
Processor socketLGA 1150 (Socket H3)
Processor threads8
Processor codenameHaswell
Processor frequency3.4 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency3.9 GHz
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)84 W
Number of processors installed1
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3-SDRAM
Memory voltage supported by processor1.5 V
Memory clock speeds supported by processor1333, 1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor32 GB
Memory slots4x DIMM
Internal memory16 GB
Memory channelsDual-channel
Memory clock speed1600 MHz
Maximum internal memory- GB
HDD size3.5 \
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Card reader integratedYes
Total storage capacity1000 GB
Intel segment taggingEnterprise, Small Business
Intel® Virtualization Technology (Intel® VT)VT-d, VT-x
On-board graphics card ID0x412
Discrete graphics card modelNVIDIA® GeForce® GT 630
On-board graphics card modelIntel® HD Graphics 4600
Discrete graphics card memory2048 GB
Discrete graphics memory typeGDDR3
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory2 GB
On-board graphics card OpenGL version4.3
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version11.2/12
On-board graphics card dynamic frequency (max)1200 MHz
Number of displays supported (on-board graphics)3
Bundled softwareHP Client Security\\r HP Trust Circles Standard\\r HP Wireless HotSpot\\r HP PageLift\\r HP Recovery Manager\\r HP Support Assistant\\r HP ePrint\\r CyberLink PowerDVD\\r CyberLink Power2Go\\r Buy Office
Recovery operating systemWindows 8.1 Pro
Operating system installedWindows 7 Professional
Cabling technology10/100/1000Base-T(X)
Ethernet LAN data rates10, 100, 1000 Mbit/s
HDMI ports quantity0
PS/2 ports quantity2
USB 2.0 ports quantity6
Chassis typeMicro Tower
Product colorBlack
Country of originChina
Audio systemRealtek ALC221
Product typePC
Motherboard chipsetIntel® H87
Scalability1S
Processor codeSR149
Processor ARK ID75122
Intel TSX-NI version0.00
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal solution specificationPCG 2013D
Intel Identity Protection Technology version1.00
Power supply300 W
Sustainability certificatesENERGY STAR
Weight and Dimensions IconWeight and Dimensions
Depth402 mm
Width182.8 mm
Height357 mm
Weight7140 g

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