HP ProLiant BL460c G6 User Manual

Electrostatic discharge 91
Electrostatic discharge
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system
or handling parts. A discharge of static electricity from a finger or other conductor may damage system
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
To prevent electrostatic damage:
• Avoid hand contact by transporting and storing products in static-safe containers.
• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
• Place parts on a grounded surface before removing them from their containers.
• Avoid touching pins, leads, or circuitry.
• Always be properly grounded when touching a static-sensitive component or assembly.
Grounding methods to prevent electrostatic discharge
Several methods are used for grounding. Use one or more of the following methods when handling or
installing electrostatic-sensitive parts:
• Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist
straps are flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords. To
provide proper ground, wear the strap snug against the skin.
• Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet when
standing on conductive floors or dissipating floor mats.
• Use conductive field service tools.
• Use a portable field service kit with a folding static-dissipating work mat.
If you do not have any of the suggested equipment for proper grounding, have an authorized reseller install
the part.
For more information on static electricity or assistance with product installation, contact an authorized
reseller.

HP ProLiant BL460c G6 Specifications

General

Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF6
Processor cache	8 MB
Processor cores	4
Processor model	E5540
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor threads	8
Processor codename	Nehalem EP
Processing Die size	263 mm²
Processor frequency	2.53 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	19
Maximum number of SMP processors	2
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	731 M
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	144 GB
HDD size	- \
HDD interface	Serial ATA, Serial Attached SCSI (SAS)
Total storage capacity	0 GB
Maximum storage capacity	1 TB
Number of HDDs installed	0
Memory slots	12x DIMM
Internal memory	6 GB
Memory clock speed	1333 MHz
Maximum internal memory	192 GB
Memory layout (slots x size)	3 x 2 GB
Cabling technology	10/100/1000Base-T(X)
USB 2.0 ports quantity	-
Chassis type	Blade
Processor ARK ID	37104
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	56 mm
Width	182 mm
Height	510 mm
Weight	6440 g