HP ProLiant ML10 v2 User Manual

Component identification 11
PCIe expansion slot definitions
Slot number Type Length Height Connector link width Negotiable link width
1
PCIe2 Half Full x4 x1signal / 25W
2
PCIe2 Half Full x8 x1 signal / 25W
3
PCIe3 Half Full x8 x8 signal / 25W
4
PCIe3 3/4 Full x16 x8 signal / 75W
System maintenance switch
Switch Default Function
1
Off Off = No function
On = iLO security is disabled
2
Off Off = System configuration can be
changed
On = System configuration is locked
5
Off Off = Power-on password is enabled
On = Power-on password is disabled
6
Off Off = No function
On = ROM reads configuration as
invalid
3, 4, 7, 8, 9,
10, 11, 12
— Reserved
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all
system configuration settings from both CMOS and NVRAM.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to
properly configure the server or data loss could occur.
NMI functionality
An NMI crash dump creates a crash dump log before resetting a system which is not responding.
Crash dump log analysis is an essential part of diagnosing reliability problems, such as failures of operating
systems, device drivers, and applications. Many crashes freeze a system, and the only available action for
administrators is to restart the system. Resetting the system erases any information which could support
problem analysis, but the NMI feature preserves that information by performing a memory dump before a
system reset.
To force the system to invoke the NMI handler and generate a crash dump log, do one of the following:
• Use the iLO Virtual NMI feature.
• Short the NMI header ("System board components" on page 9).
For more information, see the HP website (http://www.hp.com/support/NMI).

HP ProLiant ML10 v2 Specifications

General

Bus type	DMI
Stepping	C0
FSB Parity	No
Scalability	1S
Processor cache	8 MB
Processor cores	4
Processor model	E3-1220V3
System bus rate	5 GT/s
Processor series	Intel Xeon E3-1200 v3
Processor socket	LGA 1150 (Socket H3)
Processor codename	Haswell
Motherboard chipset	Intel® C222
Processor frequency	3.1 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x8, 1x16, 2x4, 2x8
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)	80 W
Compatible processor series	Intel® Xeon®
Number of processors installed	1
Thermal solution specification	PCG 2013D
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
HDD interface	-
SSD interface	Serial Attached SCSI (SAS)
Total storage capacity	1000 GB
Maximum storage capacity	24 TB
Memory slots	4x DIMM
Internal memory	8 GB
Memory clock speed	1600 MHz
Graphics card	G200
DVD interface type	SATA
Graphics card family	Matrox
Intel® Virtualization Technology (Intel® VT)	VT-d, VT-x
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
Serial ports quantity	0
USB 2.0 ports quantity	2
PCI Express slots version	3.0
Performance management	HP iLO
Compatible operating systems	Microsoft Windows Server\\r Canonical Ubuntu\\r Red Hat Enterprise Linux (RHEL)\\r SUSE Linux Enterprise Server (SLES)\\r VMware
Processor ARK ID	75052
Intel Identity Protection Technology version	1.00
Chassis type	Tower (4U)
Power supply	350 W
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 9144 m
Storage temperature (T-T)	-30 - 65 °C
Operating temperature (T-T)	0 - 40 °C
Storage relative humidity (H-H)	0 - 95 %
Operating relative humidity (H-H)	10 - 90 %
On-board graphics card model	Not available

Weight and Dimensions

Depth	475.2 mm
Width	175 mm
Height	368.2 mm