HP ProLiant ML10 v2 User Manual

Index 70
A
access panel 15
Array Configuration Utility (ACU) 47
ASR (Automatic Server Recovery) 47
authorized reseller 55, 57
Automatic Server Recovery (ASR) 47
B
battery 52
battery, installing 52
boot options 22
BSMI notice 54
buttons 6
buttons, front panel 6
C
cables 41
cabling 41
Canadian notice 54
Care Pack 19, 44, 50, 57
cautions 21, 55
Change Control 47, 50
components 6
components, front panel 6
components, identification 6
configuration of system 22, 43
connectors 6
contacting HP 57
controller 28
CSR (customer self repair) 57
customer self repair (CSR) 57
D
diagnostic tools 47
DIMM identification 33
DIMM slot locations 10
DIMMs 34
DIMMs, installing 35
DIMMs, single- and dual-rank 34
drivers 49
drives, installation guidelines 23
drives, installing 23
E
electrical grounding requirements 20
electrostatic discharge 55
enabling the Trusted Platform Module 40
environmental requirements 19, 20
environmental specifications 56
error messages 51
European Union notice 54
F
FBWC cabling 41
features 6, 47
Federal Communications Commission (FCC)
notice 54
firmware 48, 49
front panel components 6
front panel LEDs 7
G
grounding methods 55
grounding requirements 20, 55
H
hardware options installation 23
health driver 47
help resources 57
Hot-plug SAS/SATA hard drive cabling 41
HP Insight Diagnostics 45
HP Insight Remote Support software 44, 50
HP Smart Update Manager overview 46
HP technical support 50, 57
I
iLO (Integrated Lights-Out) 44
IML (Integrated Management Log) 44
Insight Diagnostics
48
in
stallation services 19, 21
installation, server options 21, 23
installing hardware 21, 23
Index

HP ProLiant ML10 v2 Specifications

General

Bus type	DMI
Stepping	C0
FSB Parity	No
Scalability	1S
Processor cache	8 MB
Processor cores	4
Processor model	E3-1220V3
System bus rate	5 GT/s
Processor series	Intel Xeon E3-1200 v3
Processor socket	LGA 1150 (Socket H3)
Processor codename	Haswell
Motherboard chipset	Intel® C222
Processor frequency	3.1 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x8, 1x16, 2x4, 2x8
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)	80 W
Compatible processor series	Intel® Xeon®
Number of processors installed	1
Thermal solution specification	PCG 2013D
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
HDD interface	-
SSD interface	Serial Attached SCSI (SAS)
Total storage capacity	1000 GB
Maximum storage capacity	24 TB
Memory slots	4x DIMM
Internal memory	8 GB
Memory clock speed	1600 MHz
Graphics card	G200
DVD interface type	SATA
Graphics card family	Matrox
Intel® Virtualization Technology (Intel® VT)	VT-d, VT-x
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
Serial ports quantity	0
USB 2.0 ports quantity	2
PCI Express slots version	3.0
Performance management	HP iLO
Compatible operating systems	Microsoft Windows Server\\r Canonical Ubuntu\\r Red Hat Enterprise Linux (RHEL)\\r SUSE Linux Enterprise Server (SLES)\\r VMware
Processor ARK ID	75052
Intel Identity Protection Technology version	1.00
Chassis type	Tower (4U)
Power supply	350 W
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 9144 m
Storage temperature (T-T)	-30 - 65 °C
Operating temperature (T-T)	0 - 40 °C
Storage relative humidity (H-H)	0 - 95 %
Operating relative humidity (H-H)	10 - 90 %
On-board graphics card model	Not available

Weight and Dimensions

Depth	475.2 mm
Width	175 mm
Height	368.2 mm