HP Spectre 13 User Manual

Equipment guidelines
Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation.
●
When seated, wear a wrist strap connected to a grounded system. Wrist straps are exible straps with a
minimum of one megohm ±10% resistance in the ground cords. To provide proper ground, wear a strap
snugly against the skin at all times. On grounded mats with banana-plug connectors, use alligator clips to
connect a wrist strap.
●
When standing, use foot straps and a grounded oor mat. Foot straps (heel, toe, or boot straps) can be
used at standing workstations and are compatible with most types of shoes or boots. On conductive oors
or dissipative oor mats, use foot straps on both feet with a minimum of one megohm resistance between
the operator and ground. To be
eective, the conductive must be worn in contact with the skin.
The following grounding equipment is recommended to prevent electrostatic damage:
●
Antistatic tape
●
Antistatic smocks, aprons, and sleeve protectors
●
Conductive bins and other assembly or soldering aids
●
Nonconductive foam
●
Conductive computerop workstations with ground cords of one megohm resistance
●
Static-dissipative tables or oor mats with hard ties to the ground
●
Field service kits
●
Static awareness labels
●
Material-handling packages
●
Nonconductive plastic bags, tubes, or boxes
●
Metal tote boxes
●
Electrostatic voltage levels and protective materials
The following table lists the shielding protection provided by antistatic bags and oor mats.
Material Use Voltage protection level
Antistatic plastics Bags 1,500 V
Carbon-loaded plastic Floor mats 7,500 V
Metallized laminate Floor mats 5,000 V
28 Chapter 4 Removal and replacement preliminary requirements

HP Spectre 13 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Silver
Housing material	Aluminium, Carbon fibre
Country of origin	China
Memory slots	1x SO-DIMM
Internal memory	8 GB
Memory clock speed	1866 MHz
Memory form factor	On-board
Internal memory type	LPDDR3-SDRAM
Memory layout (slots x size)	1 x 8 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	PCI Express
Storage media	SSD
SSD form factor	M.2
Card reader integrated	No
Total storage capacity	1024 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
LED backlight	Yes
Display surface	Gloss
Display diagonal	13.3 \
Native aspect ratio	16:9
On-board graphics card ID	0x5916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 620
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	32 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1050 MHz
Speakers manufacturer	Bang & Olufsen
Number of built-in speakers	2
WWAN	Not installed
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.2
Charging port type	DC-in jack
USB 2.0 ports quantity	0
USB Sleep-and-Charge ports	3
Cable lock slot type	Kensington
AC adapter power	45 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
AC adapter output voltage	19 V
Battery capacity	38 Wh
Battery life (max)	8 h
Number of battery cells	4
Pointing device	Touchpad
Bus type	OPI
Stepping	H0
Tjunction	100 °C
Processor cache	4 MB
Processor model	i7-7500U
System bus rate	4 GT/s
Processor family	Intel® Core™ i7
Processor socket	BGA 1356
Processor codename	Kaby Lake
Configurable TDP-up	25 W
Processor frequency	2.7 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
PCI Express configurations	1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.9 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Sustainability certificates	RoHS, EPEAT Silver, ENERGY STAR
Processor code	SR2ZV
Processor ARK ID	95451
Processor package size	42 x 24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	229 mm
Width	325 mm
Height	10.4 mm
Weight	1110 g