EasyManuals Logo

HP Spectre 13 User Manual

HP Spectre 13
76 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Page #35 background imageLoading...
Page #35 background image
Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools
and equipment.
Use conductive eld service tools, such as cutters, screw drivers, and vacuums.
When xtures must directly contact dissipative surfaces, use xtures made only of static-safe materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these items
only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn o power and input signals before inserting or removing connectors or test equipment.
Grounding guidelines 27

Table of Contents

Questions and Answers:

Question and Answer IconNeed help?

Do you have a question about the HP Spectre 13 and is the answer not in the manual?

HP Spectre 13 Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorSilver
Housing materialAluminium, Carbon fibre
Country of originChina
Memory slots1x SO-DIMM
Internal memory8 GB
Memory clock speed1866 MHz
Memory form factorOn-board
Internal memory typeLPDDR3-SDRAM
Memory layout (slots x size)1 x 8 GB
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfacePCI Express
Storage mediaSSD
SSD form factorM.2
Card reader integratedNo
Total storage capacity1024 GB
Compatible memory cardsSD, SDHC, SDXC
Number of SSDs installed1
LED backlightYes
Display surfaceGloss
Display diagonal13.3 \
Native aspect ratio16:9
On-board graphics card ID0x5916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 620
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory32 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1050 MHz
Speakers manufacturerBang & Olufsen
Number of built-in speakers2
WWANNot installed
Wi-Fi standardsWi-Fi 5 (802.11ac)
Bluetooth version4.2
Charging port typeDC-in jack
USB 2.0 ports quantity0
USB Sleep-and-Charge ports3
Cable lock slot typeKensington
AC adapter power45 W
AC adapter frequency50 - 60 Hz
AC adapter input voltage100 - 240 V
AC adapter output voltage19 V
Battery capacity38 Wh
Battery life (max)8 h
Number of battery cells4
Pointing deviceTouchpad
Bus typeOPI
SteppingH0
Tjunction100 °C
Processor cache4 MB
Processor modeli7-7500U
System bus rate4 GT/s
Processor familyIntel® Core™ i7
Processor socketBGA 1356
Processor codenameKaby Lake
Configurable TDP-up25 W
Processor frequency2.7 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3.5 GHz
Processor operating modes64-bit
PCI Express configurations1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.9 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Sustainability certificatesRoHS, EPEAT Silver, ENERGY STAR
Processor codeSR2ZV
Processor ARK ID95451
Processor package size42 x 24 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth229 mm
Width325 mm
Height10.4 mm
Weight1110 g

Related product manuals