Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 Philips Screwdriver 2
Description #2 Pry Tool
Description #3 ?
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
2.
3.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, inse
rt a graphi
c illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
* Printed Circuit Boards no longer require selective treatment. Ca
n be disposed with the remainder of the assembly.
EL-MF877-00 Page 2
Temp
late Revision A
Controller front view.
Battery Assemblies shown
on
left. Battery latch
indicated by arrow.
Remove Batter
s
.
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