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General| Form Factor | 10U |
|---|---|
| Number of Bays | 16 |
| Redundant Power | Yes |
| Redundant Fans | Yes |
| Maximum Blade Servers | 16 half-height or 8 full-height |
| Operating Temperature | 10° to 35°C (50° to 95°F) |
| Power Supplies | Up to 6 |
| Cooling Fans | 10 |
| Management | Onboard Administrator |
| Interconnect Modules | Up to 8 |
| Networking Options | Ethernet, Fibre Channel, InfiniBand |
| Compatibility | HP ProLiant and Integrity server blades |
| Relative Humidity | 10% to 90% (non-condensing) |
Identifies and verifies the contents of the enclosure shipping pallet for installation.
Specifies the dimensions and environmental conditions for installing the enclosure in a rack.
Details the conditions necessary for installing the enclosure in a non-rack environment.
Provides critical safety warnings, cautions, and important installation messages.
Outlines the necessary clearances and airflow considerations for proper enclosure operation.
Specifies the operating temperature range for the enclosure and its components.
Details electrical power specifications and compliance requirements for installation.
Explains the essential grounding procedures for safe operation and component protection.
Identifies and describes the components located on the front of the enclosure.
Illustrates the numbering scheme for the power supply bays within the enclosure.
Explains the status indicators (LEDs) for the enclosure's power supplies.
Details the numbering and location of device bays for installing server blades.
Illustrates the numbering of bays for full-height devices.
Illustrates the numbering of bays for half-height devices.
Identifies the components of the HP BladeSystem Insight Display.
Describes the feature for identifying server locations within the rack.
Identifies and describes components located on the rear of the enclosure.
Illustrates the numbering scheme for the fan bays within the enclosure.
Explains the status indicators (LEDs) for the enclosure fans.
Identifies the main components of the Onboard Administrator module.
Details the components of the Onboard Administrator with KVM functionality.
Illustrates the numbering and layout of interconnect bays for network modules.
Provides a step-by-step summary of the enclosure setup and installation process.
Details the procedure for safely disassembling the enclosure for installation.
Guides the user through the process of installing the enclosure without a rack.
Provides instructions for installing the enclosure into a standard rack.
Explains how to use the rack template for accurate rail placement.
Details the steps for mounting the rack rails onto the enclosure.
Guides the user on how to physically install the enclosure into the rack.
Describes the process of installing the rear cage assembly.
Introduces the section detailing the installation of various enclosure components.
Provides instructions for installing the power supply units into the enclosure.
Guides on how to install server or storage blades into the enclosure bays.
Details the procedure for installing full-height server blades.
Explains how to remove a device bay shelf to install full-height devices.
Guides on creating blank panels for full-height device bays.
Details the procedure for installing half-height server blades.
Explains how to install a device bay shelf for half-height devices.
Describes how to connect peripherals for local access to a server blade.
Provides steps for accessing a server blade's KVM interface locally.
Explains how to connect local media devices like CD/DVD or diskette drives.
Details the process for installing cooling fans into the enclosure.
Guides on installing the Onboard Administrator modules for management.
Details the procedure for installing network interconnect modules.
Shows how half-height blades connect to interconnect modules.
Shows how full-height blades connect to interconnect modules.
Details interconnect port mapping for BL2x220c server blades.
Maps interconnect ports for double dense server blades.
Maps interconnect ports for AMC Telco I/O expansion blades.
Details interconnect port mapping for BL680c G7 server blades.
Identifies the numbered interconnect bays on the enclosure rear.
Explains the crosslinking between adjacent interconnect bays.
Describes crosslinking between adjacent device bays.
Explains crosslinking between adjacent interconnect bays.
Details how to remove dividers for double-wide interconnect modules.
Guides on reinstalling dividers for single-wide interconnect modules.
Outlines the general procedure for cabling enclosure components.
Details the cabling connections for the Onboard Administrator module.
Explains how to cable multiple enclosures together for linking.
Guides on connecting a PC to the enclosure for management access.
Details how to connect network cables to interconnect modules.
Provides instructions for powering on the enclosure.
Details the power-up procedure for single-phase AC configurations.
Specific steps for powering up with an HP Single-Phase Intelligent Power Module.
Instructions for installing a Power Distribution Unit (PDU).
Details the power-up procedure for three-phase AC configurations.
Provides an overview of the Insight Display's functionality and interface.
Guides through the initial configuration process using the Insight Display wizard.
Explains the settings available and how to configure them on the Insight Display.
Describes the information displayed on the Enclosure Info screen.
Details how to view information about individual blades and their ports.
Explains how to manage the Unit Identification (UID) feature via the Insight Display.
Describes the screen for displaying user-defined notes or messages.
Explains the chat functionality for communication with the administrator.
Lists resources and guides for troubleshooting HP servers and enclosures.
Highlights critical safety precautions to be observed before troubleshooting.
Explains the meaning of various symbols indicating hazards on the equipment.
Consolidates important warnings and cautions related to safe operation and handling.
Describes common errors detected by the Insight Display and their meanings.
Details errors related to insufficient or improper power supply to the enclosure.
Explains errors caused by inadequate fan configuration or insufficient cooling.
Describes errors where components are installed in incorrect bays.
Details errors arising from incorrect component or mezzanine card configurations.
Explains errors indicating a failure of a specific hardware component.
Lists information required before contacting HP support for assistance.
Provides contact details and resources for HP technical support.
Explains HP's Customer Self Repair program for component replacement.
Explains how to find the unique regulatory model number for compliance.
Provides FCC compliance information for digital devices.
Describes how to interpret the FCC classification label on the equipment.
Details FCC compliance for Class A digital devices used in commercial environments.
Details FCC compliance for Class B digital devices used in residential environments.
States compliance with FCC rules for products with the FCC logo.
Warns against unauthorized modifications that could void operating authority.
Specifies requirements for using shielded cables for compliance.
Provides regulatory compliance information for Canada.
Lists EU Directives and CE marking compliance for the product.
Guides on the proper disposal of electronic waste in the EU.
Provides regulatory compliance information for Japan.
Provides regulatory compliance information for BSMI (Taiwan).
Provides regulatory compliance information for Korea.
Provides regulatory compliance information for China.
Details safety compliance for laser products included with the system.
Warns about internal battery hazards and proper handling.
Specifies battery recycling requirements for Taiwan.
Provides a statement regarding power cords for Japan.
Offers precautions to prevent damage from static electricity to system components.
Details various methods for proper grounding to prevent ESD damage.
