HP BladeSystem c3000 - User Manual

HP BladeSystem c3000 Enclosure
technology brief, 2nd edition
Abstract.............................................................................................................................................. 3
Overview of HP BladeSystem c3000 Enclosure ....................................................................................... 3
Managing the c3000 enclosure ............................................................................................................ 5
Onboard Administrator..................................................................................................................... 5
Detecting component insertion and removal..................................................................................... 5
Identifying components ................................................................................................................. 6
Managing power and cooling ....................................................................................................... 6
Controlling components................................................................................................................. 6
User interfaces for Onboard Administrator ...................................................................................... 8
Security....................................................................................................................................... 8
Role-based user accounts............................................................................................................... 8
Integrated Lights-Out 2 for c-Class server blades .................................................................................. 9
Insight Display ................................................................................................................................. 9
Onboard Administrator cabling ....................................................................................................... 10
Enclosure link cabling..................................................................................................................... 11
Enclosure-based DVD ROM................................................................................................................. 12
Enclosure KVM Module ...................................................................................................................... 12
Interconnect options and infrastructure.................................................................................................. 13
Interconnect modules ...................................................................................................................... 15
Server blades ................................................................................................................................16
Storage and other option blades...................................................................................................... 16
Mezzanine cards ........................................................................................................................... 17
Virtual Connect.............................................................................................................................. 18
Fabric connectivity and port mapping............................................................................................... 18
c3000 bay-to- bay crosslinks ........................................................................................................... 21
Device bay crosslinks.................................................................................................................. 21
Interconnect bay crosslinks .......................................................................................................... 22
HP Thermal Logic technologies ............................................................................................................ 22
Active Cool fans ............................................................................................................................ 23
HP PARSEC architecture.................................................................................................................. 24
Parallel...................................................................................................................................... 24
Redundant and scalable.............................................................................................................. 25
Thermal Logic for the server blade.................................................................................................... 26
Power supplies and enclosure power subsystem................................................................................. 27
Pooled power configuration and power redundancy options ........................................................... 29
Dynamic Power Saver mode ........................................................................................................ 30
HP Power Regulator for ProLiant ................................................................................................... 31
Power Capping for each server blade........................................................................................... 31
Power meter .............................................................................................................................. 31

HP BladeSystem c3000 Specifications

General

Form Factor	6U
Maximum Number of Blade Servers	8 half-height or 4 full-height
Maximum Number of Full-Height Blades	4
Cooling Fans	6 hot-plug fans
Management	HP Onboard Administrator
Interconnect Bays	4
Fans	6 hot-plug fans
Networking Options	Ethernet, Fibre Channel, InfiniBand
Power Supplies	Up to 6 (depending on configuration)

Summary

Abstract

Overview of HP BladeSystem c3000 Enclosure

Provides an overview of the HP BladeSystem c3000 Enclosure, its architecture, and models.

Managing the c3000 enclosure

Onboard Administrator

The core management module for the c3000 enclosure, covering detection, identification, power/cooling, and component control.

Detecting Component Insertion and Removal

Explains how the Onboard Administrator detects and identifies components inserted or removed from bays.

Identifying Components

Details how the Onboard Administrator identifies components using FRU EEPROMs and accessing server blade information via iLO 2.

Managing Power and Cooling

Covers the Onboard Administrator's role in controlling power states and managing thermal conditions using Thermal Logic.

Controlling Components

Describes how the Onboard Administrator provides detailed information and health status, and manages firmware updates.

Integrated Lights-Out 2 for c-Class Server Blades

Explains how iLO 2 is used for remote configuration, update, and operation of server blades.

Insight Display

Describes the Insight Display as an information exchange device for setup, management, and troubleshooting.

Onboard Administrator Cabling

Details the cabling for the Onboard Administrator module and its link module for connectivity.

Enclosure Optional Features

Enclosure-based DVD ROM

Discusses the optional CD/DVD ROM drive for installing software and updating firmware.

Enclosure KVM Module

Explains the KVM Module for accessing server video consoles, CLI, and Insight Display.

Interconnect Options and Infrastructure

Interconnect Modules

Covers various interconnect options like pass-thru modules, switches, and fabrics for network connectivity.

Server Blades

Details the c-Class standard form factors for server blades and their connectivity options.

Storage and Other Option Blades

Describes storage blade solutions and other option blades for increased configuration flexibility.

Mezzanine Cards

Explains HP's mezzanine card options for providing connectivity to networks and storage.

Virtual Connect Technology

Introduces Virtual Connect technology for virtualized server I/O connections to networks.

Fabric Connectivity and Port Mapping

Discusses interconnect requirements for network access and mapping server ports to interconnect bays.

c3000 Bay-to-Bay Crosslinks

Explains the midplane's SerDes signals for communication between adjacent device bays.

HP Thermal Logic Technologies

Active Cool Fans

Details the Active Cool fans technology for delivering high airflow and pressure efficiently.

HP PARSEC Architecture

Explains the PARSEC architecture for parallel, redundant, scalable, enclosure-based cooling.

Parallel Cooling Design

Describes the airtight air plenum and shutoff doors for optimizing airflow and thermal design.

Redundant and Scalable Cooling

Discusses fan population guidelines and support for varying numbers of server blades for redundancy.

Thermal Logic for Server Blades

Explains how precise ducting on server blades manages airflow and temperature.

Instant Thermal Monitoring

Covers real-time monitoring of heat, power, and cooling data.

Power Management and Subsystem

Pooled Power and Redundancy Options

Details power redundancy modes like N+N and N+1 for flexibility and future-proofing.

Dynamic Power Saver Mode

Explains the Dynamic Power Saver mode for adjusting power consumption based on demand for efficiency.

HP Power Regulator for ProLiant

Describes the iLO-controlled speed stepping for processors to improve energy efficiency.

Power Capping for Server Blades

Details how to limit power consumption of server blades to reduce heat output.

Server Power Meter

Explains the integrated power meter for analyzing actual server power usage.

HP BladeSystem Power Sizer Tool

Introduces a tool for sizing power and cooling infrastructures for HP BladeSystem solutions.

Summary

Appendix: Guidelines

Fan Population Guidelines

Details how to correctly install fans and server/storage blades in fan and device bays.

Power Supply Population Guidelines

Provides guidelines for placing power supplies in the enclosure for optimal operation and redundancy.

AC Redundancy Options

Explains AC redundancy configurations for power supplies, including N+1 and N+N options.

Server Blade Device Bay Numbering

Illustrates device bay numbering for full-height and half-height server blades.

Enclosure Zones and Dividers

Describes how the enclosure is divided into zones and the use of dividers for blade placement.