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HPE ProLiant DL180 Gen9

HPE ProLiant DL180 Gen9
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MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE ProLiant DL180 Gen9
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
8
Batteries
All types including standard alkaline and lithium
coin or button style batteries
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Depending on Power Supply
2
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Question and Answer IconNeed help?

Do you have a question about the HPE ProLiant DL180 Gen9 and is the answer not in the manual?

HPE ProLiant DL180 Gen9 Specifications

General IconGeneral
Max Processors2
Memory Slots16 DIMM slots
Form Factor2U rack
ProcessorIntel Xeon E5-2600 v3/v4 product family
StorageSATA; SAS; SSD
Expansion Slots6 PCIe 3.0 slots
Operating System SupportMicrosoft Windows Server; Red Hat Enterprise Linux (RHEL); SUSE Linux Enterprise Server (SLES); VMware vSphere
Network4 x 1Gb Ethernet ports

Summary

Items Requiring Selective Treatment

Printed Circuit Boards (PCB)

Components with a surface area greater than 10 sq cm requiring selective treatment.

Batteries

All types of batteries, including alkaline and lithium coin/button cells.

Mercury-Containing Components

Items containing mercury like lamps, displays, scanners, and switches.

Liquid Crystal Displays (LCD)

LCDs with a surface area over 100 sq cm, including gas discharge lamps.

Cathode Ray Tubes (CRT)

Components classified as Cathode Ray Tubes.

CapacitorsCondensers (PCBPCT)

Capacitors or condensers containing Polychlorinated Biphenyls or Polychlorinated Terphenyls.

Electrolytic CapacitorsCondensers (2.5 cm)

Large electrolytic capacitors/condensers measuring over 2.5 cm in diameter or height.

External Electrical Cables and Cords

Cables and cords for external electrical connections.

Gas Discharge Lamps

Lamps that operate by passing an electric discharge through a gas.

Brominated Flame Retardant Plastics (25 g)

Plastics containing brominated flame retardants weighing over 25 grams.

Components with TonerInk

Parts containing toner, ink, liquids, gels, or pastes.

Components with Asbestos

Components and waste materials containing asbestos.

Components with Refractory Ceramic Fibers

Parts and materials containing refractory ceramic fibers.

Components with Radioactive Substances

Parts and materials containing radioactive substances.

Tools Required for Disassembly

Torx Driver (T15)

Tool description and size for disassembly.

Torx Driver (T10)

Tool description and size for disassembly.

Product Disassembly Process Steps

System Board Battery Removal

Locate and remove the battery from the system board using a flat head screwdriver.

Capacitor Removal

Remove the PSU, then locate and remove capacitors (>2.5 cm) with a screwdriver.

MEGACELL Holder and Air Baffle Removal

Pull out the MEGACELL Holder and Air Baffle from the chassis.

Disassembly Visual Aids

System Battery Location Illustration

Visual guide showing the location of the system battery for removal.

Capacitor Location in PSU Illustration

Image illustrating the location of capacitors within the Power Supply Unit.

MEGACELL Holder and Air Baffle Location

Diagram showing the placement of the MEGACELL Holder and Air Baffle.

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