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Huawei Ascend Maintenance Manual
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Y210 Mobile P
hone
Maintenance Manual
4
Components on the PCBA
Issue 1.0 (
2012
-
11
-
28
)
Huawei Proprietar
y and Confidential
Copyright © Huawei Technologies Co., Ltd
.
8
SP150
2 rec
eiver
con
ta
ct
J1608
J
1608
power b
utton
spring
Fault
s caused
if damaged:
Power
butt
on
malfunctions
MIC150
1
micr
op
hone
Fault
s caused
if damaged:
No
s
ounds
for
recordings
D1602
D1603
D1604
power
butt
on LED
Fault
s caused
if damaged:
Functional
keys backlight
off
D1601
tri-c
ol
or indi
cator
Fault
s caused
if damaged:
Indicator
off
12
14
Table of Contents
About this Document
3
Change History
3
Table of Contents
4
1 Product Overview
6
Appearance
6
Features
7
2 Applicable Scope and Precautions
9
Applicable Scope
9
Precautions
9
How to Obtain Product and Repair Information
9
3 Exploded View
10
4 Components on the PCBA
12
5 Software Upgrade
14
Upgrade Preparation
14
Performing an Upgrade
14
6 Maintenance Tools
16
7 Disassembly Procedure
18
8 Assembly Procedure
22
9 Principles and Failure Analysis
26
Block Diagram
26
Functions of the PCBA
27
Baseband Unit
31
Power-On Management Circuits
31
Charging Management Circuits
35
RF Unit
36
RF Failure
36
Gps
40
Wi-Fi/Bluetooth/Fm Module
40
Peripheral Circuits
42
Display
42
Camera
45
Usb
48
Headset Jack
49
Keys and Buttons
51
Tricolor Indicator and Touch Key Backlight Circuits
52
Battery Connector
53
Accelerometer
54
Compass
55
Proximity Sensor
55
Vibration Motor
57
Receiver
58
Microphone
61
During a Call
62
Touch Panel
62
SIM Card
63
Microsd Card
64
10 Solder Points on the PCBA and BGA Chip
66
11 Functional Tests
72
MMI Test
72
Voice Call Test
75
Other manuals for Huawei Ascend
User Guide
60 pages
Quick Start Guide
2 pages
4
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Huawei Ascend Specifications
General
Brand
Huawei
Model
Ascend
Category
Cell Phone
Language
English
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