Huawei Ascend Maintenance Manual

Y210 Mobile Phone
Maintenance Manual
10 Solder Points on the PCBA and BGA Chip
Issue 1.0 (2012-11-28)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
61
10 Solder Points on the PCBA and BGA
Chip
Red (R: 255, G: 0, B: 0) : Vacant point
Green (R: 0, G: 255, B: 0) : Ground point
Blue (R: 0, G: 0, B: 255) : Solder point
Figure 10-1, Figure 10-2, Figure 10-3, and Figure 10-4 show magnified views of sections.
Figure 10-5 shows the complete PCB view.

Huawei Ascend Specifications

General

Brand	Huawei
Model	Ascend
Category	Cell Phone
Language	English