Name: Huawei Ascend
Brand: Huawei
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Y210 Mobile Phone

Maintenance Manual

Contents

Issue 1.0 (2012-11-28)

Huawei Proprietary and Confidential

9.4.3 USB ....................................................................................................................................................... 43

9.4.4 Headset Jack.......................................................................................................................................... 44

9.4.5 Keys and Buttons .................................................................................................................................. 46

9.4.6 Tricolor Indicator and Touch Key Backlight Circuits ........................................................................... 47

9.4.7 Battery Connector ................................................................................................................................. 48

9.4.8 Accelerometer ....................................................................................................................................... 49

9.4.9 Compass ................................................................................................................................................ 50

9.4.10 Proximity Sensor ................................................................................................................................. 50

9.4.11 Vibration Motor ................................................................................................................................... 52

9.4.12 Receiver .............................................................................................................................................. 53

9.4.13 Microphone ......................................................................................................................................... 56

9.4.14 Touch Panel ......................................................................................................................................... 57

9.4.15 SIM Card ............................................................................................................................................. 58

9.4.16 microSD Card ..................................................................................................................................... 59

10 Solder Points on the PCBA and BGA Chip ......................................................................... 61

11 Functional Tests......................................................................................................................... 67

11.1 MMI Test ...................................................................................................................................................... 67

11.2 Voice Call Test .............................................................................................................................................. 70