Huawei Ascend - Read Before Proceeding; Safety Precautions

Y210 Mobile Phone
Maintenance Manual
Contents
Issue 1.0 (2012-11-28)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
iv
9.4.3 USB ....................................................................................................................................................... 43
9.4.4 Headset Jack.......................................................................................................................................... 44
9.4.5 Keys and Buttons .................................................................................................................................. 46
9.4.6 Tricolor Indicator and Touch Key Backlight Circuits ........................................................................... 47
9.4.7 Battery Connector ................................................................................................................................. 48
9.4.8 Accelerometer ....................................................................................................................................... 49
9.4.9 Compass ................................................................................................................................................ 50
9.4.10 Proximity Sensor ................................................................................................................................. 50
9.4.11 Vibration Motor ................................................................................................................................... 52
9.4.12 Receiver .............................................................................................................................................. 53
9.4.13 Microphone ......................................................................................................................................... 56
9.4.14 Touch Panel ......................................................................................................................................... 57
9.4.15 SIM Card ............................................................................................................................................. 58
9.4.16 microSD Card ..................................................................................................................................... 59
10 Solder Points on the PCBA and BGA Chip ......................................................................... 61
11 Functional Tests......................................................................................................................... 67
11.1 MMI Test ...................................................................................................................................................... 67
11.2 Voice Call Test .............................................................................................................................................. 70