Huawei ME909 Series - Page 21

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Description of the Application Interfaces
Issue V0.3 (2013-05-21)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
21
PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
129
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
130
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
131
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
132
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
133
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
134
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
135
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
136
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
137
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
138
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
139
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
140
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
141
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-