Huawei ME909 Series - Mechanical Specifications

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Mechanical Specifications
Issue V0.3 (2013-05-21)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
61
6 Mechanical Specifications
6.1 About This Chapter
This chapter describes the process design and mechanical specifications:

Storage Requirement

Moisture Sensitivity

Dimensions and interfaces

Packaging

Label

Customer PCB Design

Assembly Processes

Specification of Rework
6.2 Storage Requirement
The module must be stored and sealed properly in vacuum package under a
temperature below 40°C and the relative humidity less than 90% in order to ensure
the weldability within 12 months.
6.3 Moisture Sensitivity

The moisture sensitivity is level 3.

After unpacking, the module must be assembled within 168 hours under the
environmental conditions that the temperature is lower than 30°C and the relative
humidity is less than 60%. If the preceding conditions cannot be met, the module
needs to be baked according to the parameters specified in Table 6-1 .
Table 6-1 Baking parameters
Baking Temperature
Baking Condition
Baking Duration
Remarks
125°C ±5°C
Relative humidity ≤ 60%
8 hours