Huawei ME909 Series - Packaging

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Mechanical Specifications
Issue V0.3 (2013-05-21)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
64
6.5 Packaging
HUAWEI LGA module uses five layers ESD pallet, anti-vibration foam and vacuum
packing into cartons.
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All materials used must meet eco-friendly requirements.

According to the requirements and test methods specified in EIA 541, the surface resistance
must range from 10,000 Ω to 1000,000 Ω.
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Packaging materials must be resistant to temperature higher than or equal to 150°C.

Triboelectricity must be lower than 100 V.
The following figure shows the packaging.