Huawei ME909 Series - Power Interfaces

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Description of the Application Interfaces
Issue V0.3 (2013-05-21)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
22
PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
142
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
143
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
144
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
145
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-

P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital
signal output. AI indicates pins for analog signal input.

The NC (Not Connected) pins are floating and there are no signal connected to these pins.
Yet some of these pins may be used in MU509, MC509 and MU609 module, therefore,
before you deal with these pins, please refer to the corresponding hardware guide.

The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact with us for more details about
this information.
3.3 Power Interface
3.3.1 Overview
The power supply part of the ME909 module contains:

VBAT pins for the power supply

VCC_EXT1 pin for external power output with 1.8 V

SIM_VCC pin for USIM card power output
Table 3-2 lists the definitions of the pins on the power supply interface.
Table 3-2 Definitions of the pins on the power supply interface
Pin No.
Signal
Name
I/
O
Description
DC Characteristics (V)
Min.
Typ.
Max.
12, 13
VBAT
P
Pins for power
voltage input
3.3
3.8
4.2