Huawei MU609 - Page 22

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
22
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ.
(V)
Max. (V)
Comments
117
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
118
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
119
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
120
NC
-
Not connected,
please keep this
pin open
-
-
-
-
-
121
GND
-
Thermal Ground
Pad
-
-
-
-
-
122
GND
-
Thermal Ground
Pad
-
-
-
-
-
123
GND
-
Thermal Ground
Pad
-
-
-
-
-
124
GND
-
Thermal Ground
Pad
-
-
-
-
-
125
GND
-
Thermal Ground
Pad
-
-
-
-
-
126
GND
-
Thermal Ground
Pad
-
-
-
-
-
127
GND
-
Thermal Ground
Pad
-
-
-
-
-
128
GND
-
Thermal Ground
Pad
-
-
-
-
-
129
GND
-
Thermal Ground
Pad
-
-
-
-
-
130
GND
-
Thermal Ground
Pad
-
-
-
-
-
131
GND
-
Thermal Ground
Pad
-
-
-
-
-
132
GND
-
Thermal Ground
Pad
-
-
-
-
-
133
GND
-
Thermal Ground
Pad
-
-
-
-
-
134
GND
-
Thermal Ground
Pad
-
-
-
-
-