Huawei MU609 - Power Interface; Overview

HUAWEI MU609 HSPA LGA Module
Hardware Guide
Description of the Application Interfaces
Issue 04 (2016-12-12)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
23
PIN
No.
Pin Name
Pad
Type
Description
Parameter
Min. (V)
Typ.
(V)
Max. (V)
Comments
135
GND
-
Thermal Ground
Pad
-
-
-
-
-
136
GND
-
Thermal Ground
Pad
-
-
-
-
-
137
GND
-
Thermal Ground
Pad
-
-
-
-
-
138
GND
-
Thermal Ground
Pad
-
-
-
-
-
139
GND
-
Thermal Ground
Pad
-
-
-
-
-
140
GND
-
Thermal Ground
Pad
-
-
-
-
-
141
GND
-
Thermal Ground
Pad
-
-
-
-
-
142
GND
-
Thermal Ground
Pad
-
-
-
-
-
143
GND
-
Thermal Ground
Pad
-
-
-
-
-
144
GND
-
Thermal Ground
Pad
-
-
-
-
-
145
GND
-
Thermal Ground
Pad
-
-
-
-
-

P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital
signal output. PO indicates power output pins; PI indicates power input pins.

V
IL
indicates Low-level Input voltage; V
IH
indicates High-level Input voltage; V
OL
indicates
Low-level Output voltage; V
OH
indicates High-level Output voltage.

The NC (Not Connected) pins are floating and there are no signal connected to these pins.

The Reserved pins are internally connected to the module. Therefore, these pins should not
be used, otherwise they may cause problems. Please contact with us for more details about
this information.
3.3 Power Interface
3.3.1 Overview
The power supply part of the MU609 module contains:

VBAT pins for the power supply

VCC_EXT1 pin for external power output with 1.8 V