Huawei MU736 - Packing System

HUAWEI MU736 HSPA+ M.2 Module
Hardware Guide
Mechanical Specifications
Issue 05 (2014-01-14)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
68
Figure 6-3 Dimensions of label (back label)
6.4 Packing System
HUAWEI M.2 module uses five layers ESD pallet, anti-vibration foam and vacuum
packing into cartons.