Huawei P20 Maintenance Manual

EML-L29V100R001 Advanced Maintenance Manual V2.1
INTERNAL
2019-6-25
Huawei Confidential
Page 8 of 67
2 Working Principles and Materials
2.1 Block Diagram
Figure 2-1 Phone system block diagram
Fingerprint
sensor
Gravity sensor, ambient
light sensor, compass, hall
sensor, and gyroscope
Front camera
Rear
camera+flash
4lane MIPI
SPI2
I2C
SPI3
CSI1
DDR
UFS
PCIE
UART4
I2S
Mic x 2
I2S
SIM1
SIM0
SIM SIMSSI CLK CLK
SSI
38.4 MHz
32 kHz
RGB LED
Bluetooth
/Wi-Fi
SSI
IQ
38.4 MHz
Type-C USB
USB 3.0
USB OTG
VBUS
BQ25892
charger IC
(U1603)
U1201
Buckboost
(U1201)
HI6403
Codec
(U2201)
Smart PA
(U2501)
HI6421
PMU
(U1000)
HI6363
transceiver
X 2
(U3301&U4501)
RF: FEM
Wi-Fi
Bluetooth
HI3670 SOC
(U300)
For displaying
charging status
and notification
4Lane Dual
MIPI
CSI0&2
 TP/LCD
DSI0
38.4 MHz
Vibrator
HI6422
PMU
(U1301)
38.4
MHz
DCDC
DCDC+LDO
LPDDR4X
U300_POP
DCDC
BCM435 96
(U5100)
Hi6423
U1101
UFS2.1
U1400
GPS
BCM477 4
U5603
GPS
UART3
Direct
charging
load switch
U1801
VBAT
SuperSwitch
USB 2.0
VBUS_CONUSB OTG
VBAT_SYS
The entire system is composed of the board, built-in battery, and mechanical parts. The board incorporates
the printed circuit board assembly (PCBA), side button FPC, main FPC, proximity sensor sub-board,
antenna sub-board, and other components such as the LCD module, camera module, motor, microphone,
speaker, and receiver. Mechanical parts include the middle cover, rear cover, main antenna,
GPS/Wi-Fi/Bluetooth antenna, and GSM antenna for the secondary SIM card.
2.2 Module Functions
Based on the logical functions, the board can be divided into four subsystems: baseband, RF, power supply,
and user ports. The following table describes the modules and units subordinated to each subsystem and
their functions.
Subsystem
Module
Unit
Function
Baseband
HI3670
Application unit
Octa-core processor, with support for function
modules, such as SD 3.0, UART, SPI, SDIO,
I2C, I2S, PCM, HSI, HSIC, MIPI, DVP, GPIO,
HDMI, USB, keypad, LPDDR4 controller,

Huawei P20 Specifications

General

Panel type	TFT
Screen shape	Flat
Pixel density	428 ppi
Second display	No
Display diagonal	5.8 \
Touch technology	Multi-touch
Touchscreen type	Capacitive
Display resolution	2244 x 1080 pixels
Native aspect ratio	19:9
Rounded display corners	Yes
Display number of colors	16 million colors
Processor cores	4
Processor family	Hi-Silicon
Processor frequency	2.36 GHz
Coprocessor frequency	1.8 GHz
Processor architecture	ARM Cortex-A73
Coprocessor architecture	ARM Cortex-A53
RAM capacity	4 GB
Compatible memory cards	Not supported
Internal storage capacity	128 GB
Flash type	LED
Rear camera type	Dual camera
Front camera type	Single camera
Video recording modes	1080p, 2160p
Rear camera aperture number	1.8
Front camera aperture number	2
Rear camera resolution (numeric)	12 MP
Front camera resolution (numeric)	24 MP
Second rear camera aperture number	1.6
Second rear camera resolution (numeric)	20 MP
4G standard	LTE
2G standards	GSM
3G standards	WCDMA
SIM card type	NanoSIM
Wi-Fi standards	802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.2
Bluetooth profiles	A2DP, APT-X
SIM card capability	-
Mobile network generation	4G
Subscription type	No subscription
USB version	3.2 Gen 1 (3.1 Gen 1)
USB connector type	USB Type-C
HDMI ports quantity	0
Multimedia Messaging Service (MMS)	Multimedia Messaging Service (MMS) is a standard way to send messages that include multimedia content to and from a mobile phone over a cellular network
Form factor	Bar
Product color	Blue
Themes	Wallpapers
Graphics card	Mali-G72 MP12
Personalization	Icons, Menu, Shortcuts
Personal info management (PIM)	Alarm clock, Calculator, Calendar, Notes
Speakers	stereo
Audio formats supported	3GP, AAC, APE, FLAC, MIDI, MP3, OGG, WAV
Video formats supported	3G2, 3GP, ASF, H.264, MKV, MP4, WEBM
Platform	Android
Operating system installed	Android 8.1
Talk time (3G)	- h
Battery capacity	3400 mAh
Battery recharge time	1.5 h
Interface adapters included	USB Type-C - 3.5mm

Weight and Dimensions

Depth	7.65 mm
Width	70.8 mm
Height	149.1 mm
Weight	165 g