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ICP DAS USA ET-7000 Series - Appendix F: Frame Ground

ICP DAS USA ET-7000 Series
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Appendix F: Frame Ground
ET-7000 AIO User Manual, Apr. 2009, V1.04, EMH-011-104----------146
Appendix F: Frame Ground
Electronic circuits are constantly vulnerable to Electro-Static Discharge (ESD), which become
worse in a continental climate area. ET-7000 series modules feature a new design for the frame
ground, which provides a path for bypassing ESD, allowing enhanced static protection (ESD)
capability and ensures that the module is more reliable.
The following options will provide a better protection for the module:
The ET-7000 controller has a metallic board attached to the back of the plastic basket as shown
in the Figure F-1 below. When mounted to the DIN rail, connect the DIN rail to the earth ground
because the DIN rail is in contact with the upper frame ground as shown in the Figure F-2 below.

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