Information furnished is believed to be accurate and reliable. However, SGS-THOMSONMicroelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. Nolicence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSONMicroelectronics.
Specifications mentione d in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSONMicroelectronics products are not authorized for use as critical components inlife
support devices or systems without express written approval of SGS-THOMSONMicroelectronics.
Purchase of I
2
C Components of SGS-THOMSONMicroelectronics, conveys a license under the Philips
I
2
C Patent. Rights to use these components in a I
2
C system, is granted provided that the system confo rms to
the I
2
C Standard Specifications as defined by Philips.
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L2
L3L5
L7
L6
Dia.
A
C
D
E
D1
H3
H2
F
G
G1
G2
L1
L
MM1
F1
PM HEPTV EPS
PACKAGE MECHANICAL DATA : 9 PINS- PLASTIC HEPTAWATT
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.8 0.189
C 1.37 0.054
D 2.4 2.8 0.094 0.110
D1 1.2 1.35 0.047 0.053
E 0.35 0.55 0.014 0.022
F 0.6 08 0.024 0.031
F1 0.9 0.035
G 2.41 2.54 2.67 0.095 0.100 0.105
G1 4.91 5.08 5.21 0.193 0.200 0.205
G2 7.49 7.62 7.8 0.295 0.300 0.307
H2 10.4 0.409
H3 10.05 10.4 0.396 0.409
L 16.97 0.668
L1 14.92 0.587
L2 21.54 0.848
L3 22.62 0.891
L5 2.6 3 0.102 0.118
L6 15.1 15.8 0.594 0.622
L7 6 6.6 0.236 0.260
M 2.8 0.110
M1 5.08 0.200
Dia. 3.65 3.85 0.144 0.152
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