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Technical Reference

2.7 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using a parts count

method. The calculation is based on the Telcordia SR-332, Method I Case 1 50%

electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates

and spare parts requirements. The MTBF data is calculated from predicted data at

55 ºC. The MTBF for the board is 70,677 hours.

2.8 Environmental

Table 25 lists the environmental specifications for the board.

Table 25. Environmental Specifications

Parameter Specification

Temperature

Non-Operating

-40

C to +60

(Note)

Operating

0 °C to +50 °C

The operating temperature of the board may be determined by measuring the

air temperature from within 1 inch of the edge of the chipset/PCH heatsink and

1 inch above the board, in a closed chassis, while the system is in operation.

Shock

Unpackaged 50 g trapezoidal waveform

Velocity change of 170 inches/second²

Packaged

Half sine 2 millisecond

Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²)

<20 36 167

21-40 30 152

41-80

136

81-100 18 118

Vibration

Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz

20 Hz to 500 Hz: 0.02 g² Hz (flat)

Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)

40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

Note: Before attempting to operate this board, the overall temperature of the board must be above the

minimum operating temperature specified. It is recommended that the board temperature be at least

room temperature before attempting to power on the board.

Intel DH61BF User Manual

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